Publications
Codes
Research software developed at the Terahertz Engineering Laboratory.
End-to-End Wireless Communication Chain Simulator
A MATLAB application for modelling, testing, and demonstrating complete wireless communication chains, built to align with the laboratory's transmission hardware. It supports sinusoidal and complex waveform transmission, with built-in digital compensation modules, including IQ-imbalance correction and coarse time-synchronisation, for evaluating system robustness and isolating hardware-induced impairments. Designed as a standalone interface for rapid experimentation, algorithm development, and hardware-in-the-loop testing.
Developed by Marlon Kha
CST Simulation of Substrateless Terahertz Waveguide
A Python automation script for CST Studio Suite (Python 3.12, CST Microwave Studio 2025) that builds, configures, and runs full-wave transient simulations for substrateless (effective-medium-clad) dielectric terahertz waveguides, based on the design principles below.
W. Gao, X. Yu, M. Fujita, T. Nagatsuma, C. Fumeaux, and W. Withayachumnankul, “Effective-medium-cladded dielectric waveguides for terahertz waves,” Optics Express, vol. 27, no. 26, pp. 38721–38734, 2019.W. Gao, W. S.-L. Lee, X. Yu, M. Fujita, T. Nagatsuma, C. Fumeaux, and W. Withayachumnankul, “Characteristics of effective-medium-clad dielectric waveguides,” IEEE Transactions on Terahertz Science and Technology, vol. 11, no. 1, pp. 28–41, 2021.
Modal Index of a Perforated Silicon Slab
A Python notebook (NumPy, SciPy, Matplotlib) that computes the modal index of an air-clad silicon slab perforated by a triangular lattice of air holes, for both TE and TM polarisations over 220–330 GHz. It replaces the hole array with an anisotropic effective medium, solves the slab-waveguide dispersion relations, and plots the modal index against hole diameter and frequency, following the formulation in the paper below.
D. Headland, M. Fujita, G. Carpintero, T. Nagatsuma, and W. Withayachumnankul, “Tutorial: Terahertz integration platforms using substrateless all-silicon microstructures,” APL Photonics, vol. 8, art. no. 091101, 2023.